研究助理教授 系统设计与智能制造学院
薛珂博士,2005年获哈尔滨工业大学机械工程学士学位,2010 年获香港科技大学机械工程博士学位。薛珂博士长期在企业任职,具有丰富的半导体封装产品设计和研发经验。在加入南方科技大学之前,历任恩智浦半导体香港有限公司高级工程师、主任工程师以及香港应用科技研究院有限公司(ASTRI)主任工程师/项目主管等职位。任职恩智浦半导体期间,主导完成了公司小功率器件产品的可靠性设计(Design for Reliability)及量产导入。任职香港应用科技研究院有限公司期间,负责系统级封装(SiP)以及大功率 IGBT 模组等产品的可靠性设计及优化,其成果获得了业界合作伙伴的广泛认可。薛珂博士具有十余年的电子封装仿真及可靠性评估优化经验,主导完成了数十项工程项目,获得三项国际发明专利授权。并获颁美国项目管理协会(PMI)的项目管理专业人员(PMP)认证,以及美国质量学会(ASQ)注册可靠性工程师(CRE)认证。
个人简介
研究领域
1、半导体封装产品的结构设计及可靠性优化
2、系统级封装及功率半导体器件的可靠性设计/散热设计
3、先进电子封装材料、工艺及可靠性分析
4、复合材料力学行为的宏观-微观建模与仿真
学术成果 查看更多
[1] Weiqiang Li; Ke Xue; Haibin Chen; Kan Lee; Guangxu Cheng; Jingshen Wu.; “Failure Mechanism of Fly Die in Eutectic Bonding”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.5, no. 6, pp. 838-844, 2015.
[2] Weiqiang Li, Haibin Chen, Jiale Han, Ke Xue, Fei Wong, Shiu, I., “Effects of copper plating thickness of Ni/Fe alloy leadframe on the thermal performance of Small Outline Transistor (SOT) packages”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.3, no. 10, pp. 1713-1719, 2013.
[3] Yejun Zhu; Haibin Chen; Ke Xue; Martin Li; Jingshen Wu, “Thermal and reliability analysis of clip bonding package using high thermal conductivity adhesive”, IEEE 15th Electronics Packaging Technology
Conference, pp. 259-263, 2013.
[4] Ke Xue, Jingshen Wu, Haibin Chen, Jingbo Gai and Lam, A., “Reliability based design optimization for fine pitch ball grid array: Modeling construction and DOE analysis,” 11th Electronics Packaging Technology Conference (EPTC), pp. 812-817, 2009.
[5] Ke Xue, Jingshen Wu, Haibin Chen, Jingbo Gai and Lam, A., “Warpage prediction of fine pitch BGA by finite element analysis and shadow moiré technique,” 10th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), pp. 317-321, 2009.
[6] Ke Xue, Jingshen Wu, Haibin Chen, Yongqiao Sun, Kwan, K., Yuen, J. and Lam, A., “Numerical analysis of interfacial delamination in thin array plastic package,” 9th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), pp. 1-5, 2008.