Chair Professor, Dean School of System Design and Intelligent Manufacturing

Prof. Wu Jingshen received his B.Sc. degree in Polymer Chemistry from the Department of Applied Chemistry of USTC in 1983 and PhD degree in Mechanical Engineering from the Department of Mechanical and Mechatronic Engineering of Sydney University in 1994.

Prof. Wu is a Chair Professor and the founding Dean of the School of System Design and Intelligent Manufacturing of the Southern University of Science and Technology (SUSTech), which was established in Nov. 2018.

Before joining SUSTech, Prof. Wu was a tenured professor in the Department of Mechanical and Aerospace Engineering of the Hong Kong University of Science and Technology (HKUST) since January 1996. He is an oversea member of the review panel for UG education of the Ministry of Education of China, an adjunct Professor of USTC, XJTU, HEU, Sichuan University.

Personal Profile


The research interests of Prof. Wu Jingshen include microelectronic package structure design, processing optimization and product reliability; microstructure-processing condition-property relationship of polymer and polymer composites.


Course Title: Failure Mechanisms of Polymers in Microelectronic Packages

Compulsory/Elective: Elective

Course Credit/Hours: 3/64

Teaching Language: English

Instructors: Prof. Wu Jingshen, Prof. Xue Ke

Students: PG

Teaching Methods: Lecture and Lab

Course Assessment:

* Midterm Exam (Open Book) 20%

* Project report (Two Reports) 30%

* Presentation (Individual) 50%

Course Objectives:

1. To provide the students with a basic understanding of the roles that polymer materials playing in the microelectronic and microsystem packages (e-package) and its importance in product design.

2. To provide the students with an understanding on physical and chemical properties of polymer materials that are critical in e-packge reliability.

3. To introduce the concept of material selection and design for assembly and manufacturing of e-packages.

4. To introduce the failure behavors and mechanisms of e-packages due to polymer materials failure.

5. To introduce the charaterization and simulation tools that are used in e-package design and realibility assessment

6. To provide students with basic knowledge on the insutry size of e-package manufacturing and the understanding the controlling factors that dectating the quality of massive production in reality

Textbook and Supplementary Readings:

Fracture Behavior of Polymers, A.J. Kinloch and R.J. Young Fundamentals of Microsystems Packaging, R. Tummala, ed., Advanced Electronic Packaging, Richard K. Ulrich and William D. Brown

Publications Read More

Honors and awards

1995-1998   Received the Australian National Research Council Postdoctoral Fund

1991-1993  Received the Australian Youth Research Fund 

1997 and 2000   Received the Outstanding Teaching Award of the Hong Kong University of Science and Technology

2000  Received the Visiting Scholar Fund of the Key Laboratory of the Ministry of Education.

Industrial cooperation

He has been a senior consultant of international and domestic famous enterprises such as NXP, AMD, Kingfa Technology, Midea, Sinopec Beijing Research Institute, and provided effective solutions for a large number of engineering problems encountered by enterprises.

News More

  • SDIM receives donation from Huijie Intelligent Control for intern base

  • Professor WU Jingshen Interpreted “New Engineering” at the Cloud Lecture Hall


Lab members Read More

Join us

Contact Us

Contact Address

1088 Xueyuan Blvd., Nanshan District, Shenzhen Guangdong, P.R. China

Office Phone


Copyright © 2018 All Rights Reserved.