Assistant Professor School of Microelectronics

Dr. Yida Li is currently an Assistant Professor at the Southern University of Science and Technology, Shenzhen, China. He graduated from the National University of Singapore with a Ph.D. degree in Integrative Science and Engineering Program in 2013. From 2014 to 2016, he was with Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu as a process R&D principal engineer working on metal deposition and sillicidation at the 7/5 nm technology node, with both technology node currently in mass production. From 2016 to 2020, he was a research fellow at the National University of Singapore working with Professor Aaron Thean.

Dr. Li has published more than 35 papers in international academic journals and conferences. His work presented in VLSI 2018, Honolulu, USA was featured in prominent industry magazine, Compound Semiconductor. In addition, he has given invited talks at renowned international conferences including Graphene Flagship 2019 and VLSID 2020.

Personal Profile


1. Novel/Emerging memory and logic devices targeting at Non-Von Neumann computing architecture and neuromorphic circuits

2. Hardware accelerators and compute-in-memory system architecture


SME102 (Spring) - Microelectronics Fundamentals

To introduce the basic concepts, basic laws, theorems and analysis methods of electric circuits and the basic physics of semiconductor devices. Applications of devices in building amplifier, logic gates, basic circuits and CMOS Process will also be taught.

SME203 (Autumn) - Fundamentals of Microelectronics I

The course will introduce students to the materials science and engineering behind semiconductor devices, including their applications and processing. Topics for the course include kinetic molecular theory and thermally activated processes; electrical and thermal conductivity of metals and semiconductors; introductory quantum mechanics for materials science; band structure and intrinsic and extrinsic semiconductors.

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1. Y. Li, X. Feng, M. Sivan, J. F. Leong, B. Tang, X. Wang, J. N. Tey, J. Wei, K. W. Ang and A. V. Y. Thean, Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton with Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration, IEEE Sensors, vol. 20, no. 9, pp. 4653-4659, May 2020

2. J. Pan, Y. Luo, Y. Li*, C. Tham, C. Heng and A. V. Thean, “A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-based Gesture Recognition with AI at the Edge,” in IEEE Transactions on Circuits and Systems II: Express Briefs, DOI: 10.1109/TCSII.2020.3010318. *co-first (Early Access)

3. Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng, “A 70μW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver”, 2020 IEEE International Solid-State Circuits Conference, pp. 346-348, 2020

4. B. Xiong, Y. Li, A. V. Thean and C. Heng, “A 7 x 7 x 2 mm3 8.6- µW 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications,” in IEEE Journal of Solid-State Circuits, vol. 55, no. 6, pp. 1698-1708, June 2020

5. Y. Luo, Y. Li, A. V. Thean and C. Heng, “An 8.2- µW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter,” in IEEE Journal of Solid-State Circuits, vol. 55, no. 5, pp. 1361-1373, May 2020

6. Maheswari Sivan, Yida Li*, Hasita Veluri, Yunshan Zhao, Tang Baoshan, Xinghua Wang, Evgeny Zamburg, Jin Feng Leong, Jessie Xuhua Niu, Umesh Chand & Aaron Voon-Yew Thean*, All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration, Nat Comms, 10, 5201, November 2019

7. Y. Li, A. Alian, M. Sivan, L. Huang, K.-W. Ang, D. Lin, D. Mocuta, N. Colleart, and A. V.-Y. Thean, “A Flexible InGaAs Nanomembrane PhotoFET with Tunable Responsivities in Near- & Short-Wave IR Region for Lightweight Imaging Applications”, APL Materials, February 2019

8. Y. Li, Y. Luo, S. Nayak, Z. Liu, O. Chichvarina, E. Zamburg, X. Zhang, Y. Liu, C. H. Heng, A. V.‐Y. Thean, A Stretchable-Hybrid Low-Power Monolithic ECG Patch with Microfluidic Liquid-Metal Interconnects and Stretchable Carbon-Black Nanocomposite Electrodes for Wearable Heart Monitoring, Advanced Electronic Materials, October 2019

9. Y. Li, Suryakanta Nayak, Yuxuan Luo, Yijie Liu, Hari Krishna Salia Vijay, Jieming Pan, Zhuangjian Liu, Chun Huat Heng, and Aaron Voon-Yew Thean, “A Soft PDMS-Liquid Metal Interdigitated Capacitor Sensor and Its Integration in a Flexible Hybrid System for On-Body Respiratory Sensing”, Materials, 12 (9), 1458, 2019

10. Suryakanta Nayak, Yida Li, Willie Tay, Evgeny Zamburg, Devendra Singh, Chengkuo Lee, Soo Jin Adrian Koh, Patrick Chia, Aaron Voon-Yew Thean, “Liquid-Metal-Elastomer Foam for Moldable Multi-Functional Triboelectric Energy Harvesting and Force Sensing”, Nano Energy, 64, 103912, 2019.

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Join us

Dr. Yida Li welcomes individuals passionate in research to join his research group. He has openings for Research Assistant Professor & Postdoctoral Fellows (x2), Research Assistants (x2), Graduate Students, as well as Internships.

Research topics include but not limited to:

  1. Novel and emerging memory and logic devices targeting at Non-Von Neumann computing architecture and neuromorphic circuits

  2. Additive processing and heterogeneous integration of materials to create the new generation of hybrid-flexible wearable devices

Required/Desired Skills and Qualifications:

  1. Degree in Electrical & Electronic/Material Science/Biology and Chemical Engineering or other related fields
  2. Motivated and cheerful individual, able to work under stress
  3. Independent research thinking ability and to identify and solve problem systematically
  4. Responsible individual with great team spirit
  5. Good English listening, speaking, reading and writing skills,
  6. Experience in at least 1 of the following
    • nano-fabrication, nano-materials, memory and logic devices characterization, modelling
  7. 2 related publications as first/corr-authors
  8. The postdoctoral position has an age limit of 35 year old


  1. A contract period of 2 years
  2. Successful candidate will enjoy an initial annual salary exceeding 350,000 RMB (depending on qualifications)
  3. Multiple research grants provided by Shenzhen government

How to apply:

Interested individuals are invited to email a copy of his/her CV to the below email address, with subject titled “Research position application <Position, Name>”.

Instead of hesitating, why not join us and find out for yourself!

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Contact Us

Contact Address

Room 417, Block 3, Zhi Yuan Chong Wen Yuan, Nanshan, Shenzhen, Guangdong, China 518055

Office Phone



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