1. Novel/Emerging memory and logic devices targeting at Non-Von Neumann computing architecture and neuromorphic circuits

2. Hardware accelerators and compute-in-memory system architecture

SME102 (Spring) - Microelectronics Fundamentals

To introduce the basic concepts, basic laws, theorems and analysis methods of electric circuits and the basic physics of semiconductor devices. Applications of devices in building amplifier, logic gates, basic circuits and CMOS Process will also be taught.

SME203 (Autumn) - Fundamentals of Microelectronics I

The course will introduce students to the materials science and engineering behind semiconductor devices, including their applications and processing. Topics for the course include kinetic molecular theory and thermally activated processes; electrical and thermal conductivity of metals and semiconductors; introductory quantum mechanics for materials science; band structure and intrinsic and extrinsic semiconductors.

1. Y. Li, X. Feng, M. Sivan, J. F. Leong, B. Tang, X. Wang, J. N. Tey, J. Wei, K. W. Ang and A. V. Y. Thean, Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton with Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration, IEEE Sensors, vol. 20, no. 9, pp. 4653-4659, May 2020

2. J. Pan, Y. Luo, Y. Li*, C. Tham, C. Heng and A. V. Thean, “A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-based Gesture Recognition with AI at the Edge,” in IEEE Transactions on Circuits and Systems II: Express Briefs, DOI: 10.1109/TCSII.2020.3010318. *co-first (Early Access)

3. Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng, “A 70μW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver”, 2020 IEEE International Solid-State Circuits Conference, pp. 346-348, 2020

4. B. Xiong, Y. Li, A. V. Thean and C. Heng, “A 7 x 7 x 2 mm3 8.6- µW 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications,” in IEEE Journal of Solid-State Circuits, vol. 55, no. 6, pp. 1698-1708, June 2020

5. Y. Luo, Y. Li, A. V. Thean and C. Heng, “An 8.2- µW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter,” in IEEE Journal of Solid-State Circuits, vol. 55, no. 5, pp. 1361-1373, May 2020

6. Maheswari Sivan, Yida Li*, Hasita Veluri, Yunshan Zhao, Tang Baoshan, Xinghua Wang, Evgeny Zamburg, Jin Feng Leong, Jessie Xuhua Niu, Umesh Chand & Aaron Voon-Yew Thean*, All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration, Nat Comms, 10, 5201, November 2019

7. Y. Li, A. Alian, M. Sivan, L. Huang, K.-W. Ang, D. Lin, D. Mocuta, N. Colleart, and A. V.-Y. Thean, “A Flexible InGaAs Nanomembrane PhotoFET with Tunable Responsivities in Near- & Short-Wave IR Region for Lightweight Imaging Applications”, APL Materials, February 2019

8. Y. Li, Y. Luo, S. Nayak, Z. Liu, O. Chichvarina, E. Zamburg, X. Zhang, Y. Liu, C. H. Heng, A. V.‐Y. Thean, A Stretchable-Hybrid Low-Power Monolithic ECG Patch with Microfluidic Liquid-Metal Interconnects and Stretchable Carbon-Black Nanocomposite Electrodes for Wearable Heart Monitoring, Advanced Electronic Materials, October 2019

9. Y. Li, Suryakanta Nayak, Yuxuan Luo, Yijie Liu, Hari Krishna Salia Vijay, Jieming Pan, Zhuangjian Liu, Chun Huat Heng, and Aaron Voon-Yew Thean, “A Soft PDMS-Liquid Metal Interdigitated Capacitor Sensor and Its Integration in a Flexible Hybrid System for On-Body Respiratory Sensing”, Materials, 12 (9), 1458, 2019

10. Suryakanta Nayak, Yida Li, Willie Tay, Evgeny Zamburg, Devendra Singh, Chengkuo Lee, Soo Jin Adrian Koh, Patrick Chia, Aaron Voon-Yew Thean, “Liquid-Metal-Elastomer Foam for Moldable Multi-Functional Triboelectric Energy Harvesting and Force Sensing”, Nano Energy, 64, 103912, 2019.