Assistant Professor School of Microelectronics

Dr. Yida Li is currently an Assistant Professor at the Southern University of Science and Technology, Shenzhen, China. He graduated from the National University of Singapore with a Ph.D. degree in Integrative Science and Engineering Program in 2013. From 2014 to 2016, he was with Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu as a process R&D principal engineer working on metal deposition and sillicidation at the 7/5 nm technology node, with both technology node currently in mass production. From 2016 to 2020, he was a research fellow at the National University of Singapore working with Professor Aaron Thean.

 

Dr. Li has published more than 40 papers in international academic journals and conferences. His work presented in VLSI 2018, Honolulu, USA was featured in prominent industry magazine, Compound Semiconductor. In addition, he has given invited talks at renowned international conferences including Graphene Flagship 2019 and VLSID 2020.

Personal Profile

Research

1. Novel/Emerging memory and logic devices targeting at Non-Von Neumann computing architecture and neuromorphic circuits

2. Hardware accelerators and compute-in-memory system architecture


Teaching

SME102 (Spring) - Microelectronics Fundamentals (Undergraduate)

To introduce the basic concepts, basic laws, theorems and analysis methods of electric circuits and the basic physics of semiconductor devices. Applications of devices in building amplifier, logic gates, basic circuits and CMOS Process will also be taught.

 

SME203 (Autumn) - Fundamentals of Microelectronics I (Undergraduate)

The course will introduce students to the materials physics behind semiconductor devices, including their applications and processing. Topics for the course include kinetic molecular theory and thermally activated processes; electrical and thermal conductivity of metals and semiconductors; introductory quantum mechanics for materials science; band structure and intrinsic and extrinsic semiconductors.

 

SME204 (Spring) - Fundamental of Microelectronics II (Undergraduate)

The course will introduce students to the underlying physics and mechanisms in legacy semiconductor devices including PN Diode, Bipolar Junction Transistor, Metal-Oxide-Semiconductor Field-Effect Transistor. Device simulation using TCAD software will also be introduced.

 

SME5024 (Spring) - Introduction to In-Memory Computing - From Materials to System (Graduate)

This course will introduce graduate students to one of the most popular non-von Neumann computing architecture that is slated to be implemented in future computer chips for abundant data calculation. Concepts to be taught to students will include 1. Non- von neumann computing architecture, 2. Emerging devices for in-memory computing, 3. Analog Memory Programming Techniques and Variations, 4. Artificial Neural Networks based on In-memory computing, 5. Circuit Primitives for Analog Computing.


Publications Read More

Selected Journals (Past 3 years)

1. J. Pan*, Y. Li*(co-first), Y. Luo, X. Zhang, X. Wang, D. L. T. Wong, C.-H. Heng, C.-K. Tham, and A. V.-Y. Thean, “Hybrid-Flexible Bimodal Sensing Wearable Glove System for Complex Hand Gesture Recognition” ACS Sensors Article ASAP, DOI: 10.1021/acssensors.1c01698, 2021

2. H. Veluri, Y. Li, J. X. Niu, E. Zamburg and A. V. -Y. Thean, “High-Throughput, Area-Efficient, and Variation-Tolerant 3-D In-Memory Compute System for Deep Convolutional Neural Networks,” in IEEE Internet of Things Journal, vol. 8, no. 11, pp. 9219-9232, 1 June1, 2021, doi: 10.1109/JIOT.2021.3058015.

3. H. Veluri, U. Chand, Y. Li, B. Tang and A. V. -Y. Thean, “A Low-Power DNN Accelerator Enabled by a Novel Staircase RRAM Array,” in IEEE Transactions on Neural Networks and Learning Systems, doi: 10.1109/TNNLS.2021.3118451.

4. Y. Li, X. Feng, M. Sivan, J. F. Leong, B. Tang, X. Wang, J. N. Tey, J. Wei, K. W. Ang and A. V. Y. Thean, Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton with Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration, IEEE Sensors, vol. 20, no. 9, pp. 4653-4659, May 2020

5. J. Pan*, Y. Luo*, Y. Li*(co-first), C. Tham, C. Heng and A. V. Thean, “A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-based Gesture Recognition with AI at the Edge,” in IEEE Transactions on Circuits and Systems II: Express Briefs, DOI: 10.1109/TCSII.2020.3010318., Dec 2020 (*co-first)

6. Y. Luo, Y. Li, A. V. -Y. Thean and C. -H. Heng, “A 70-μW 1.35-mm² Wireless Sensor With 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver,” in IEEE Journal of Solid-State Circuits, vol. 56, no. 7, pp. 2065-2076, July 2021

7. B. Xiong, Y. Li, A. V. Thean and C. Heng, “A 7 x 7 x 2 mm3 8.6- µW 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications,” in IEEE Journal of Solid-State Circuits, vol. 55, no. 6, pp. 1698-1708, June 2020

8. Luo, Y. Li, A. V. Thean and C. Heng, “An 8.2- µW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter,” in IEEE Journal of Solid-State Circuits, vol. 55, no. 5, pp. 1361-1373, May 2020

9. M. Sivan, Y. Li*(co-corr), H. Veluri, Y. Zhao, B. Tang, X. Wang, E. Zamburg, J. F. Leong, J. X. Niu, U. Chand and A. V.-Y. Thean*, All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration, Nat Comms, 10, 5201, 2019

10. Li, A. Alian, M. Sivan, L. Huang, K.-W. Ang, D. Lin, D. Mocuta, N. Colleart, and A. V.-Y. Thean, “A Flexible InGaAs Nanomembrane PhotoFET with Tunable Responsivities in Near- & Short-Wave IR Region for Lightweight Imaging Applications”, 7, 031503, APL Materials, February 2019

11. Y. Li, Y. Luo, S. Nayak, Z. Liu, O. Chichvarina, E. Zamburg, X. Zhang, Y. Liu, C. H. Heng, A. V.‐Y. Thean, A Stretchable-Hybrid Low-Power Monolithic ECG Patch with Microfluidic Liquid-Metal Interconnects and Stretchable Carbon-Black Nanocomposite Electrodes for Wearable Heart Monitoring, Advanced Electronic Materials, October 2019

12. Y. Li, Suryakanta Nayak, Yuxuan Luo, Yijie Liu, Hari Krishna Salia Vijay, Jieming Pan, Zhuangjian Liu, Chun Huat Heng, and Aaron Voon-Yew Thean, “A Soft PDMS-Liquid Metal Interdigitated Capacitor Sensor and Its Integration in a Flexible Hybrid System for On-Body Respiratory Sensing”, Materials, 12 (9), 1458, 2019

13. X. Feng, Y. Li, L. Wang, S. Chen, Z. G. Yu, W. C. Tan, N. Macadam, G. Hu, L. Huang, L. Chen, X. Gong, D. Chi, T. Hasan, A. V.-Y. Thean, Y.-W. Zhang, and K.-W. Ang, “A fully-printed flexible MoS2 memristive artificial synapse with femto joules switching energy”, Advanced Electronic Materials 5, 1900740, 2019

 

Selected Conferences (Past 3 years)

1. M. Shen, J. Lu, W. Wang, J. Lan, J. Liang, F. Zhou, L. Lin, Y. Li*, “Field-Effect Mobility Enhancement in Low Temperature ALD ZnO Thin-film Transistors via Contact Defects Engineering Suitable for BEOL Integration”, 2022 IEEE Electron Devices Technology and Manufacturing (EDTM), Oita, Japan, March 2022

2. J. Lan, Q. Zhu, Y. Zhang, M. Zaheer, J. Liang, W. Wang, M. Shen, Z. Li, Z. Chen, H. Wei, G. Zhang, and Y. Li*, “Zinc-Alloyed HfO2 Based Artificial Synaptic RRAM With Operating Voltages And Switching Energy Improvement For Ultra-High-Density Embedded Memory Applications”, 2022 IEEE CSTIC, Shanghai, China, June 2022 (accepted)

3. W.  Wang, J. Lu, J. Lan, B. Zhou, Y. Zhang, J. Liang, M. Shen*, G. Zhang, F. Zhou, L. Lin and Y. Li*, “Air Stable High Mobility ALD ZnO TFT With HfO2 Passivation Layer Suitable For CMOS-BEOL Integration”, 2022 IEEE CSTIC, Shanghai, China, June 2022 (accepted)

4. Y. Luo, Y. Li, A. V. Y. Thean and C. H. Heng, “A 70μW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver”, 2020 IEEE International Solid-State Circuits Conference, 2020, pp. 346-348.

5. X. Feng, Y. Li, Lin. Wang, Z. G. Yu, S. Chen, W. C. Tan, N. Macadam, G. Hu, X. Gong, T. Hasan, Y. -W. Zhang, A. V. -Y. Thean and K.-W. Ang, “First Demonstration of Fully-printed RRAM on Flexible Substrate Featuring Low Switch Voltage and its Application as Electronic Synapse”, Proceedings of VLSI, 2019

6. Y. Li et al, Aerosol Jet Printed WSe2 Based RRAM on Kapton Suitable for Flexible Monolithic Memory Integration, 2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), 2019

7. B. Xiong, Y. Li, Aaron Voon-Yew Thean, Chun-Huat Heng, A 7×7×2mm3 8.6-μW 500-kb/s Transmitter with Robust Injection-Locking Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications, CICC Proceedings, 2019

News More

  • Paper Acceptance at SSDM 2022

    2022-08-06
  • Paper acceptance at IEEE Electron Device Letters

    2022-05-22
  • Congratulations to Wenhui Wang for his grant proposal acceptance at Guangdong Province graduate students “攀登计划”

    2022-04-03

Lab members Read More

Join us

Dr. Yida Li welcomes individuals passionate in research to join his research group. He has openings for Research Assistant Professor & Postdoctoral Fellows (x2), Research Assistants (x2), Graduate Students, as well as Internships.
Research topics include but not limited to:


Novel/Emerging memory and logic devices targeting at Non-Von Neumann computing architecture and neuromorphic circuits


Hardware accelerators and compute-in-memory system architecture



Required/Desired Skills and Qualifications:

Degree in Electrical & Electronic/Material Science/Biology and Chemical Engineering or other related fields
Motivated and cheerful individual, able to work under stress
Independent research thinking ability and to identify and solve problem systematically
Responsible individual with great team spirit
Good English listening, speaking, reading and writing skills,
Experience in at least 1 of the following

nano-fabrication, nano-materials, memory and logic devices characterization, modelling


2 related publications as first/corr-authors
The postdoctoral position has an age limit of 35 year old


Remuneration/Benefit:

A contract period of 2 years
Successful candidate will enjoy an initial annual salary exceeding 350,000 RMB (depending on qualifications)
Multiple research grants provided by Shenzhen government


How to apply:
Interested individuals are invited to email a copy of his/her CV to the below email address, with subject titled “Research position application <Position, Name>”.
Contact:liyd3@sustech.edu.cn
Instead of hesitating, why not join us and find out for yourself!
Read More

Contact Us

Contact Address

Room 417, Block 3, Zhi Yuan Chong Wen Yuan, Nanshan, Shenzhen, Guangdong, China 518055

Office Phone

0755-8801-5895

Email

liyd3@sustech.edu.cn

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