李嘉敏

副教授 深港微电子学院

李嘉敏,本科、博士毕业于新加坡国立大学电子工程系,于2022年8月加入南方科技大学深港微电子学院,任助理教授,博士生导师,于24年起任副教授。主要从事面向体域物联网无线能量与数据传输的电路与系统设计,低功耗生物医疗片上系统设计,能量采集、传输及电源管理芯片设计,智能感知ASIC设计等。相关成果发表于Nature Electronics、集成电路领域顶级期刊 IEEE Journal of Solid-State Circuits (JSSC)、生物医疗电子期刊IEEE Transactions on Biomedical Circuits and Systems (TBioCAS)、集成电路顶会ISSCC、知名会议VLSI、ESSCIRC、ASSCC等。同时担任国际固态电路会议 (ISSCC) Student Research Preview (SRP) 技术委员会委员、国际固态电路协会 (IEEE SSCS) Women-in-Circuit Committee成员,多个期刊和会议审稿人。入选国家高层次青年人才计划,主持国家和省市级科研项目。曾获得国际固态电路协会2020-2021 IEEE SSCS Predoctoral Achievement Award、国际固态电路会议ISSCC 2020 Demonstration Session Certificate of Recognition (a.k.a Best Demo Award)、ISSCC 2020 Student Travel Grant Award、亚洲固态电路会议ASSCC 2021 Student Design Contest (SDC) Best Design Award。

个人简介

研究领域

面向体域通信及供能网络的电路与系统设计

生物医疗片上系统设计

能量采集、传输及电源管理芯片设计

智能感知ASIC设计


学术成果 查看更多

International Journals:

  • J. Li, Y. Dong, L. Lin, J. S. Y. Tan, J. Y. Fong and J. Yoo, “Concurrent Body-Coupled Powering and Communication ICs With a Single Electrode,” IEEE Journal of Solid-State Circuits (Early Access)
  • J. Guo, J. Li and J. Yoo, “A Hybrid Boost Converter with Standard CMOS-Compatible ,” IEEE Solid-State Circuits Letters, vol. 6, pp. 125-128, 2023.
  • T. He, Y. Zheng, X. Liang, J. Li, L. Lin, W. Zhao, Y. Li, and J. Zhao, “A Highly Energy-Efficient Body-Coupled Transceiver Employing a Power-on-Demand Amplifier,” Cyborg and Bionic Systems, vol. 4, 2023.
  • L. Wu, J. Guo, R. Jiang, Y. Peng, H. Wu, J. Li, Y. Luo, L. Lin, and J. Yoo, “An Ultrasound Imaging System with On-Chip Per-Voxel RX Beamfocusing for Real-Time Drone Applications,” IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 11, pp. 3186-3199, Nov. 2022. 
  • J. Li*, Y. Dong*, J. H. Park, and J. Yoo, “Body-Coupled Power Transmission and Energy Harvesting,” Nature Electronics, vol. 4, pp. 530-538, 2021.
  • J. S. Y. Tan, J. H. Park, J. Li, Y. Dong, K. H. Chan, G. W. Ho, and J. Yoo, “A Fully Energy-Autonomous Temperature-to-Time Converter Powered by a Triboelectric Energy Harvester for Biomedical Applications,” IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 10, pp. 2913-2923, Oct. 2021.
  • J. Li*, Y. Dong*, J. H. Park, L. Lin, T. Tang, and J. Yoo, “Body-Area Powering with Human Body-Coupled Power Transmission and Energy Harvesting ICs,” IEEE Transactions on Biomedical Circuits and Systems, vol.14, no. 6, pp. 1263-1273, Dec. 2020.
  • J. Li, A. Ashraf, B. Cardiff, R. C. Panicker, Y. Lian and D. John, “Low Power Optimisations for IoT Wearable Sensors Based on Evaluation of Nine QRS Detection Algorithms,” IEEE Open Journal of Circuits and Systems, vol. 1, pp. 115-123, 2020.
  • T. Tang, L. Yan, J. H. Park, H. Wu, L. Zhang, J. Li, Y. Dong, B. H. Y. Lee, J. Yoo, “An Active Concentric Electrode for Concurrent EEG Recording and Body-Coupled Communication (BCC) Data Transmission,” IEEE Transactions on Biomedical Circuits and Systems, vol. 14, no. 6, pp. 1253-1262, Dec, 2020.
  • J. S. Y. Tan, J. H. Park, J. Li, Y. Dong, K. H. Chan, G. W. Ho, and J. Yoo, “A 0.14 pJ/conversion Fully EnergyAutonomous Temperature-To-Time Converter for Biomedical Applications,” IEEE Solid-State Circuits Letters, vol. 3, pp. 466-469, 2020. (A-SSCC cross publication)

International Conferences:

  • W. Chen+, C. Gao+, Y. Zhu, L. Lin, and J. Li*, “Intra-Body Wireless Power and Data Links for Biomedical Microsystems,” 2023 IEEE Biomedical Circuits and Systems Conference (BioCAS), Toronto, Canada, 19-21 Oct. 2023.
  • Y. Zhu, J. Fong, L. Lin, J. Yoo, and J. Li*, “Biomedical System-on-Chip Design with Integrated Body-Coupled Powering,” 2023 IEEE Biomedical Circuits and Systems Conference (BioCAS), Toronto, Canada, 19-21 Oct. 2023.
  • J. Li*, Y. Dong*, L. Lin. J. S. Y. Tan, J. Y. Fong, and J. Yoo, “Wireless Body-Area Network Transceiver ICs with Concurrent Body-Coupled Powering and Communication using Single Electrode,” IEEE Symposium on VLSI Circuits (VLSI Symposium), June, 2023.
  • L. Wu, J. Guo, R. Jiang, Y. Peng, H. Wu, J. Li, Y. Dong, M. Zhang, Z. Li, K. A. Ng, C-W. Tsai, L. Zhang, L. Lin, L. Lin and J. Yoo, “BatDrone: A 9.83M-focal points/s, 7.76μs Latency Ultrasound Imaging Sensor SoC with On-Chip Per-Voxel RX Beam-Focusing for 7-m Range Drone Applications”, IEEE International Solid-State Circuits Conference (ISSCC), Feb. 2022.
  • J. Guo, J. Li, and J. Yoo, “A 14V Hybrid Boost Converter with Scalable Conversion Ratio in 180nm Standard CMOS for an Ultrasound Imaging System”, IEEE Asian Solid-State Circuits Conference (A-SSCS), Nov. 2022.  
  • J. Li and J. Yoo, “Body-Coupled Powering for Wearables,” 2022 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT), Busan, Koera, Replublic of , 2022, pp. 38-39.
  • Y. Dong*, J. Li*, L. Lin, T. Tang, J. H. Park, K. A. Ng, M. Zhang, L. Zhang, J. S. Y. Tan, and J. Yoo, “BodyCoupled Power Transceiver for Node-Specific Body-Area Powering,” IEEE European Solid-State Circuits Conference (ESSCIRC), Sep. 2021.
  • H. Wu, M. Zhang, J. Guo, Z. Shao, K. A. Ng, J. Li, L. Zhang, Y. Dong, L. Wu, C-W, Tsai, B. H. Y. Lee, L. Lin, and J. Yoo, “A 7m-range, 4.3mW/Ch. Ultrasound ASIC with Universal Energy Recycling TX for All-Weather Metamorphic Robotic 3D Vision System,” IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2021.
  • M. Zhang, L. Zhang, J. H. Park, C-W. Tsai, K. A. Ng, L. Lin, Y. Dong, J. Li, T. Tang, H. Wu, L. Wu and Jerald Yoo, “A One-Shot Learning, Online-Tuning, Closed-Loop Epilepsy Management SoC with 0.97uJ/Classification and 97.8% Vector-Based Sensitivity,” IEEE Symposium on VLSI Circuits (VLSI Symposium), June, 2021.
  • J. Li*, Y. Dong*, J. H. Park, L. Lin, T. Tang, M. Zhang, H. Wu, L. Zhang, J. S. Y. Tan, and J. Yoo, “HumanBody-Coupled Power-Delivery and Ambient-Energy-Harvesting ICs for a Full-Body-Area Power Sustainability,” IEEE International Solid-State Circuits Conference (ISSCC) Dig. Tech. Papers, vol. 63, pp. 514-516, Feb. 2020. Winner, ISSCC 2020 Demonstration Session Certificate of Recognition (Best Demo Award)
  • J. S. Y. Tan, J. H. Park, J. Li, Y. Dong, K. H. Chan, G. W. Ho, and J. Yoo, “A 0.14 pJ/conversion Fully EnergyAutonomous Temperature-To-Time Converter for Biomedical Applications,” IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2020. (SSC-L cross publication) (single doi for the A-SSCC2020/SSC-L).

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