professor School of Microelectronics
Dr. Yuejin Guo graduated from the California Institute of IC Technology（Caltech）, is a IC packaging expert, long times in the United States Intel company engaged in IC packaging research and development and mass production, Yuejin Guo led the development of high-performance thermal conductive materials has been used in more than 95% of the world's high-end computers (data centers, cloud computing and supercomputer, etc.). Articles published in Science (2, 1) and Nature (1, 1) have been cited by the industry nearly a thousand times for the study of the electrical, thermal, and mechanical properties of materials using quantum chemistry and molecular dynamics methods. Its fan-out package project, won the 2018 Shenzhen "Start-up Star" competition in various industries championship (the world's more than 4000 innovative enterprises first place).
1. Research and development of package for heat dissipation of Gan RF super power amplifier based on diamond substrate
2. Packaging research and development of GaN power amplifier and power device
3. Fan-out package
Main course: Chip packaging and reliability (Undergraduate,Master,Doctoral)