Publications

  • Journal Papers
  • Invention Patent

REPRESENTATIVE JOURNAL PAPERS:

  1. Yin J F, Bai Q, Goel S, Ping Z, Zhang B. An analytical model to predict the depth of sub-surface damage for grinding of brittle materials[J]. CIRP Journal of Manufacturing Science and Technology, accepted.
  2. Li S , Zhang B , Bai Q . Effect of temperature buildup on milling forces in additive/subtractive hybrid manufacturing of Ti-6Al-4V[J]. International Journal of Advanced Manufacturing Technology, 2020, 107(9–12).
  3. Feng Y Q, Xie G Y, Zhang B, Qiao G W, Gao S, Bai Q. Influence of laser power and surface condition on balling behavior in selective laser melting[J]. Acta Aeronauticaet et Astronautica Sinica, 2019, 40(12): 423089.
  4. Wang L Q, Zhang B, Bai Q, Wang Y B. Research on Eddy Current Detection of Defects for Additive/Subtractive Hybrid Manufacturing[J]. Acta Aeronautica et Astronautica Sinica, 2019, 41(3).
  5. Yin J, Bai Q, Zhang B. Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering[J]. Journal of Manufacturing Science and Engineering.2019, 141(10).
  6.  Zhang,B., Yin,J.The “skin effect”of subsurface damage distribution in materials subjected to high-speed machining. International Journal of Extreme Manufacturing.2019.
  7.  Yang,X.,Zhang, B. Material embrittlement in high strain-rate loading. International Journal of Extreme Manufacturing.2019.
  8. Zhigang Dong, Liwei Ou, Renke Kang, Huiqin Hu, Zhang, B, Dongming Guo, Kang Shi. Photoelectrochemical mechanical polishing method for n-type gallium nitride. CIRP Annals - Manufacturing Technology, 2019, 68(1): 205-208.
  9.   Li, J.Q., Fan, T.H., Taniguchi, T., Zhang, B. Phase-field modeling on laser melting of a metallic powder. International Journal of Heat and Mass Transfer. 2018,117:412-424.
  10. Yin J , Bai Q , Li Y , Zhang, B.et al. Formation of subsurface cracks in silicon wafers by grinding[J]. Nanotechnology and Precision Engineering, 2018, 1(3).
  11.  Zheng, F.F., Dong Z.G., Kang, R.K., Zhang, B., Zhu, X.L., Liu J.T..Analysis of material removal behavior in ultrasonically assisted scratching of RB-SiC from energy aspects[J]. The International Journal of Advanced Manufacturing Technology, 2018.
  12.   Du, W., Bai, B., Wang, Y.B., Zhang, B. Eddy current detection of subsurface defects for additive/subtractive hybrid manufacturing. Journal of Advanced Manufacturing Technology.2017,1-11.
  13.  Yin J F, Bai Q , Zhang B . Methods for Detection of Subsurface Damage: A Review[J]. Chinese Journal of Mechanical Engineering, 2018, 31(1):41.
  14.   Wang, L., Zhou, P., Yan Y., Zhang, B., Kang, R.K., Guo, D.M. Chemical-Mechanical Wear of Monocrystalline Silicon by a Single Pad Asperity. Inter. J. Machine Tools & Manuf. 2017,120: 61-71.
  15.   Zhang, B., Li, Y.T., Bai, Q. Defect Formation Mechanisms in Selective Laser Melting: A Review. The Chinese Journal of Mechanical Engineering (English Ed.) .2017,30(3) :515-527.
  16.  Gao, S., Kang, R.K., Dong, Z.G., Zhang, B., Wang, Z.G. Surface Integrity and Removal Mechanism in Grinding Sapphire Wafers with Novel Vitrified Bond Diamond Plates. Materials and Manufacturing Processes.2017.32(2) :121-126.
  17.   Du,W., Bai, B.,Zhang, B. A Novel Method for Additive/Subtractive Hybrid Manufacturing of 18Ni-C300 Steel. Procedia Manufacturing .2016,5:1018-1030.
  18.   Zhang,Z.Y., Wang, B., Kang, R.K.,Zhang, B., Guo, D.M. Changes in Surface Layer of Silicon Wafers from Diamond Scratching. Annals of the CIRP. 2015,64 :349-352.
  19.  Niu,F.Y., Wu, D.J., Ma,G.Y., Zhou, S.Y.,Zhang, B. Effect of Second-Phase Doping on Laser Deposited Al2O3 Ceramics. The Rapid Prototyping Journal .2015,21(2):201-206.

PATENTS :

  1. 张璧,李帅,“增减等材加工装置和控制方法”,专利公开号:CN111168068A,专利申请号:0,IPC分类号:B22F3/105,B22F3/17,B22F3/24,B33Y10/00,B33Y30/00,B33Y50/02,2020.02.13。
  2. 张璧,李帅,“增减等材加工装置”,专利公开号:CN211939041U,专利申请号:2,IPC分类号:B22F3/105,B22F3/17,B22F3/24,B33Y10/00,B33Y30/00,B33Y50/02,2020.02.13。
  3. 张璧,李帅,“异种粉末有序排布装置、排布系统及排布方法”,专利公开号:CN110561583A,专利申请号:CN201910840529.7,IPC分类号:B28B1/00,B28B13/02,B22F3/105,C23C24/10,B33Y30/00,2019.09.06。
  4. 张璧,李帅,“异种粉末有序排布装置及排布系统”,专利公开号:CN211389283U,专利申请号:3,IPC分类号:B28B1/00,B28B13/02,B22F3/105,C23C24/10,B33Y30/00,2019.09.06。
  5. 张璧,乔国文,“一种电主轴及加工设备”,专利公开号:N210648517U,专利申请号:7,IPC分类号:B23B19/02,2019.09.17。
  6. 张璧,白倩,殷景飞,李庆鹏,“一种采用偏振激光散射检测半导体材料亚表面损伤的装置”,专利公开号:CN109781665A,专利申请号:0,IPC分类号:G01N21/49,G01N21/59,2018.11.27。
  7. 白倩,张璧,殷景飞,马浩,“一种偏振激光散射检测单晶硅亚表面损伤的方法”,专利公开号:CN109781666A,专利申请号:4,IPC分类号:G01N21/49,G01N21/59,2018.11.27。
  8. 白倩,张琦,封衡,张璧,“激光直接成型的光粉主动调节同轴送粉喷嘴”.授权专利号: ZL201710680838.3.
  9.  白倩,张璧,王龙群,乔国文,“内部含有闭合型人工缺陷的涡流检测试块及其加工方法和使用方法”.专利公开号:CN110045012A,专利申请号:CN 201910324820.9. 
  10. 白倩,张璧,王立航,汤寒宇,吴頔,“采用定向晶粒控制的电化学机械抛光工件的预处理方法”. 专利公开号:CN110067017A,专利申请号:CN201910319778.1.
  11.  白倩,杜巍,王义博,张璧,“将超声切削应用于送粉式增减材复合制造中的设备及加工方法”.专利公开号:CN107127583A,专利申请号:CN 201710347910.0.
  12.  白倩,杜巍,王义博,张璧,“金属材料高能束增减材 在线激光超声检测复合加工方法”. 专利公开号:CN107102061A,专利申请号:CN 201710348577.5.
  13. 张璧,杜巍,白倩,“一种金属材料高能束增减材-在线涡流检测复合加工方法”,专利公开号:CN106770634A,专利申请号:CN 201611125184.
  14.  张璧,白倩,杜巍,李永涛,“一种选区激光熔化复合制造机床及工件复合制造方法”,专利公开号:CN105382259A,专利申请号:CN 201510884888.
  15. 康仁科,董志刚,鲍岩,朱祥龙,周平,张璧,“一种用于飞机蒙皮镜像铣削的液体静压支撑头及支撑装置”,专利公开号:ZL2017102301767440, 专利申请号: CN 201610348616.7.
  16.  张璧,白倩,杜巍,黄鑫,郭东明,“一种激光同轴送粉复合制造机床及工件复合制造方法”,专利公开号:CN105397494A, 专利申请号:CN 201510918480.
  17.  张璧,马广义,吴东江. “一种增减材复合制造机床”,专利公开号:CN104384936A,专利申请号:CN 201410479453.
  18. 吴东江,牛方勇,周思雨,马广义,张璧,“一种激光近净成形过程中快速确定激光功率的方法”,专利公开号:CN104029395A,专利申请号:CN 201410240479.
  19.  张璧,张灿,“汽车内外吸尘器”,专利公开号:CN103612620A.专利申请号: CN 201310374048.4.
  20.  张璧,张细汉,孙长国,马康,刘彦峰,单亚琼,齐文松,“一种农用机械的旋转密封装置”,专利公开号:CN103591148A,专利申请号:CN201310603314.6
  21.  张璧,“一种用于提高轴承寿命的密封装置及其使用方法”,专利公开号:CN102808851A,专利申请号:CN201210184576.9.
  22.  张高峰,张璧,邓朝晖,谭援强,“有序化超硬纤维刀具及制造方法”,专利公开号:CN101642819,专利申请号:CN200910044212.9.
  23. 张璧,罗红平,周志雄,“一种柔性回转轴承”,专利公开号:CN101086278, 专利申请号:CN200710035092.7.
  24. 张璧,邓朝晖,周志雄,“纳米结构陶瓷涂层材料的精密磨削技术”,专利公开号:CN1562564,专利申请号:CN200410023027.9. 
  25.  Bi Zhang, Y.H. Yang,“Vacuum-Hydrostatic Shoe for Centerless Grinding” ,专利公开号:U.S. 6,287,183 B1.

Copyright © 2018 All Rights Reserved.