Publications

  • Journal Papers
  • Invention Patent

2021

1. J. Pan*, Y. Li*(co-first), Y. Luo, X. Zhang, X. Wang, D. L. T. Wong, C.-H. Heng, C.-K. Tham, and A. V.-Y. Thean, "Hybrid-Flexible Bimodal Sensing Wearable Glove System for Complex Hand Gesture Recognition" ACS Sensors Article ASAP, DOI: 10.1021/acssensors.1c01698, 2021

2. H. Veluri, U. Chand, Y. Li, B. Tang and A. V. -Y. Thean, "A Low-Power DNN Accelerator Enabled by a Novel Staircase RRAM Array," in IEEE Transactions on Neural Networks and Learning Systems, doi: 10.1109/TNNLS.2021.3118451 (early access)

3. B. Tang, Y. Zhao, C. Zhou, M. Zhang, H. Zhu, Y. Li, J. F. Leong, H. Shuai, H. Gong, W. Yang “Threshold voltage modulation in monolayer MoS2 field-effect transistors via selective gallium ion beam irradiation”, Sci China Materials, 2021

4. J. Pan, K. L. Low, J. Ghosh, S. Jayavelu, M. M. Ferdaus, S. Y. Lim, E. Zamburg, Y. Li, B. Tang, X. Wang, J. F. Leong, S. Ramasamy, T. Buonassisi, C.-K. Tham, and A. V.-Y. Thean, “Transfer Learning-Based Artificial Intelligence-Integrated Physical Modeling to Enable Failure Analysis for 3 Nanometer and Smaller Silicon-Based CMOS Transistors”, ACS Appl. Nano Mater., 4, 7, 6903–6915, 2021

5. Y. Zhao, M. Zheng, J. Wu, X. Guan, A. Suwardi, Y. Li, M. Lal, G. Xie, G. Zhang, L. Zhang and J. T. L. Thong, “Modification of thermal transport in few-layer MoS2 by atomic-level defects engineering”, Nanoscale, 13, 11561-11567, 2021

6. H. Veluri, Y. Li, X. Niu, E. Zamburg, A. V. Thean, “High Throughput, Area-Efficient, and Variation-Tolerant 3D In-memory Compute System for Deep Convolutional Neural Networks”, IEEE Internet of Things Journal, vol. 8, no. 11, pp. 9219-9232, June, 2021

2020

1. Y. Li, X. Feng, M. Sivan, J. F. Leong, B. Tang, X. Wang, J. N. Tey, J. Wei, K. W. Ang and A. V. Y. Thean, Aerosol Jet Printed WSe2 Crossbar Architecture Device on Kapton with Dual Functionality as Resistive Memory and Photosensor for Flexible System Integration, IEEE Sensors, vol. 20, no. 9, pp. 4653-4659, May 2020

2. J. Pan*, Y. Luo*, Y. Li (co-first)*, C. Tham, C. Heng and A. V. Thean, "A Wireless Multi-Channel Capacitive Sensor System for Efficient Glove-based Gesture Recognition with AI at the Edge," in IEEE Transactions on Circuits and Systems II: Express Briefs, DOI: 10.1109/TCSII.2020.3010318., Dec 2020 (*co-first)

3. Yuxuan Luo, Yida Li, Aaron Voon-Yew Thean, Chun-Huat Heng, “A 70μW 1.19mm2 Wireless Sensor with 32 Channels of Resistive and Capacitive Sensors and Edge-Encoded PWM UWB Transceiver”, 2020 IEEE International Solid-State Circuits Conference, pp. 346-348, 2020

4. B. Xiong, Y. Li, A. V. Thean and C. Heng, "A 7 x 7 x 2 mm3 8.6- µW 500-kb/s Transmitter With Robust Injection-Locking-Based Frequency-to-Amplitude Conversion Receiver Targeting for Implantable Applications," in IEEE Journal of Solid-State Circuits, vol. 55, no. 6, pp. 1698-1708, June 2020

5. Y. Luo, Y. Li, A. V. Thean and C. Heng, "An 8.2- µW 0.14-mm2 16-Channel CDMA-Like Capacitance-to-Digital Converter," in IEEE Journal of Solid-State Circuits, vol. 55, no. 5, pp. 1361-1373, May 2020

2019

1. Maheswari Sivan, Yida Li (co-corr)*, Hasita Veluri, Yunshan Zhao, Tang Baoshan, Xinghua Wang, Evgeny Zamburg, Jin Feng Leong, Jessie Xuhua Niu, Umesh Chand & Aaron Voon-Yew Thean*, All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integration, Nat Comms, 10, 5201, November 2019

2. Y. Li, A. Alian, M. Sivan, L. Huang, K.-W. Ang, D. Lin, D. Mocuta, N. Colleart, and A. V.-Y. Thean, “A Flexible InGaAs Nanomembrane PhotoFET with Tunable Responsivities in Near- & Short-Wave IR Region for Lightweight Imaging Applications”, APL Materials, February 2019

3. Y. Li, Y. Luo, S. Nayak, Z. Liu, O. Chichvarina, E. Zamburg, X. Zhang, Y. Liu, C. H. Heng, A. V.‐Y. Thean, A Stretchable-Hybrid Low-Power Monolithic ECG Patch with Microfluidic Liquid-Metal Interconnects and Stretchable Carbon-Black Nanocomposite Electrodes for Wearable Heart Monitoring, Advanced Electronic Materials, October 2019

4. Y. Li, Suryakanta Nayak, Yuxuan Luo, Yijie Liu, Hari Krishna Salia Vijay, Jieming Pan, Zhuangjian Liu, Chun Huat Heng, and Aaron Voon-Yew Thean, "A Soft PDMS-Liquid Metal Interdigitated Capacitor Sensor and Its Integration in a Flexible Hybrid System for On-Body Respiratory Sensing", Materials, 12 (9), 1458, 2019

5. Suryakanta Nayak, Yida Li, Willie Tay, Evgeny Zamburg, Devendra Singh, Chengkuo Lee, Soo Jin Adrian Koh, Patrick Chia, Aaron Voon-Yew Thean, "Liquid-Metal-Elastomer Foam for Moldable Multi-Functional Triboelectric Energy Harvesting and Force Sensing", Nano Energy, 64, 103912, 2019.

1. Multi-Bit-Per-Cell Three-Dimensional Resistive Random-Access Memory (3D-RRAM) (US11170863), 2021

2. Method and System for Integrity Testing of Packages (PCT/SG2019/029825 A1) - WO 2021/029825 A1

3. Wearable Body Comprising Capacitive Sensor (PCT/SG2020/050487) - WO 2021/040617 A1

4. Pressure Sensor And A Method Of Sensing Pressure (PCT/SG2020/050703) - WO 2021/107884 A1

5. Formation Method of interconnection structure of semiconductor device (US10658234B2), 2020

6. Metal Liner Overhang Reduction and Manufacturing Method Thereof (US9899258B1), 2018

 

 

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