Research Topics

The group is interdisciplinary and motivated to basic research but with interests in practical applications of our research in electronic materials industries. The group combines knowledge of materials chemistry, polymer physics, electronic ceramic materials, material engineering, and chemical engineering science, to design novel materials for ultra-high speed network communication applications. Our research topics cover the following areas:

  • 1、Reliability and solutions of high-performance printed circuit board substrates. 
  • 2、R&D and intelligent manufacturing technology of ultra-high speed network communication copper clad laminate. 
  • 3、Development and application of special electronic ceramic materials. 

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