Research Assistant Professor School of System Design and Intelligent Manufacturing
Prof. Xue obtained his bachelor degree in mechanical engineering from Harbin Institute of Technology in 2005 and Ph.D in mechanical engineering from the Hong Kong University of Science and Technology in 2010. After then, Dr. Xue has worked in industry for a long time and built-up extensive experience in designing and developing semiconductor packaging products. Prior to joining Southern University of Science and Technology, he served as Senior Engineer and Chief Engineer of NXP Semiconductors Hong Kong Ltd., and Lead Engineer/Project Leader of Hong Kong Applied Science and Technology Research Institute Ltd., (ASTRI). During his tenure at NXP Semiconductors, he led the design of the company's small signal semiconductor packaging design for reliability and mass production. During his career at ASTRI, he was responsible for the reliability design and optimization of system-in-package (SiP) and high-power electronic devices. His contribution has been widely recognized by industry partners. Dr. Xue has more than ten years of experience in electronic package simulation and reliability optimization. He has led dozens of projects and filed three international invention patents. He is also awarded the Project Management Professional (PMP) certification from the American Project Management Institute (PMI) and the American Society of Quality (ASQ) Certificated Reliability Engineer (CRE) certification.
Reliability design and optimization of semiconductor packaging products
Structural design and heat dissipation analysis of system-level packaging and high power devices
Advanced electronic packaging materials, process and reliability
Macro-microscopic modeling and simulation of mechanical behavior of composite materials