Chair Professor, Dean School of System Design and Intelligent Manufacturing
Prof. Wu Jingshen received his B.Sc. degree in Polymer Chemistry from the Department of Applied Chemistry of USTC in 1983 and PhD degree in Mechanical Engineering from the Department of Mechanical and Mechatronic Engineering of Sydney University in 1994.
Prof. Wu is a Chair Professor and the founding Dean of the School of System Design and Intelligent Manufacturing of the Southern University of Science and Technology (SUSTech), which was established in Nov. 2018.
Before joining SUSTech, Prof. Wu was a tenured professor in the Department of Mechanical and Aerospace Engineering of the Hong Kong University of Science and Technology (HKUST) since January 1996. He is an oversea member of the review panel for UG education of the Ministry of Education of China, an adjunct Professor of USTC, XJTU, HEU, Sichuan University.
His research interests include structure design and materials for microelectronic packages; processing optimization and product reliability; microstructure-processing condition-property relationship of polymer and polymer composites. Electric properties of polymer and polymer composites under extreme conditions.
Course Title: Failure Mechanisms of Polymers in Microelectronic Packages
Course Credit/Hours: 3/64
Teaching Language: English
Instructors: Prof. Wu Jingshen, Prof. Xue Ke
Teaching Methods: Lecture and Lab
* Midterm Exam (Open Book) 20%
* Project report (Two Reports) 30%
* Presentation (Individual) 50%
1. To provide the students with a basic understanding of the roles that polymer materials playing in the microelectronic and microsystem packages (e-package) and its importance in product design.
2. To provide the students with an understanding on physical and chemical properties of polymer materials that are critical in e-packge reliability.
3. To introduce the concept of material selection and design for assembly and manufacturing of e-packages.
4. To introduce the failure behavors and mechanisms of e-packages due to polymer materials failure.
5. To introduce the charaterization and simulation tools that are used in e-package design and realibility assessment
6. To provide students with basic knowledge on the insutry size of e-package manufacturing and the understanding the controlling factors that dectating the quality of massive production in reality
Textbook and Supplementary Readings:
Fracture Behavior of Polymers, A.J. Kinloch and R.J. Young Fundamentals of Microsystems Packaging, R. Tummala, ed., Advanced Electronic Packaging, Richard K. Ulrich and William D. Brown