professor School of Microelectronics

Dr. Yuejin Guo graduated from the California Institute of IC Technology(Caltech), is a IC packaging expert, long times in the United States Intel company engaged in IC packaging research and development and mass production, Yuejin Guo led the development of high-performance thermal conductive materials has been used in more than 95% of the world's high-end computers (data centers, cloud computing and supercomputer, etc.). Articles published in Science (2, 1) and Nature (1, 1) have been cited by the industry nearly a thousand times for the study of the electrical, thermal, and mechanical properties of materials using quantum chemistry and molecular dynamics methods. Its fan-out package project, won the 2018 Shenzhen "Start-up Star" competition in various industries championship (the world's more than 4000 innovative enterprises first place).

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